Follow Neowin, in May, Intel announced it would spend $3.5 billion on its Rio Rancho packaging facility in Albuquerque, New Mexico (USA). Encapsulation is an essential part of semiconductor design and manufacturing. It not only affects the cost of chip production, but also affects the power, performance, and basic functionality of the chip at the micro level.
Packaging plays an important role in semiconductor manufacturing
Intel is now expanding into a new generation of packaging called “copper hybrid interconnects”. This is used when the chip size is less than 10 microns and provides a 10x improvement in connection density.
The new investment not only helps Intel develop cutting-edge packaging facilities, but also insulates them from US economic policies and international relations. The US-China trade war has affected Intel and China’s enterprise expansion projects.